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PRELIMINARY
CSPESD301/302/303
1,2 and 3-Channel ESD Arrays in CSP
Features
* * * * * * 1, 2 or 3 channels of ESD protection 15kV ESD protection (IEC 61000-4-2, contact discharge) 30kV ESD protection (HBM) Supports both AC and DC signal applications 4 bump, 1.06 x 0.93mm footprint Chip Scale Package (CSP) Chip Scale Package features extremely low lead inductance for optimum ESD and filter performance
Product Description
The CSPESD301/302/303 is a family of 1, 2, and 3channel ESD protection arrays, which integrate two, three and four identical avalanche-style diodes. It is intended that one of these diodes is connected to GND and the other diodes provide ESD protection for up to 3 lines depending upon the configuration utilized. The back-to-back diode connections provide ESD protection for nodes that have AC signals present. These devices provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The diodes are designed and characterized to safely dissipate ESD strikes of 15kV, well beyond the maximum requirements of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, these devices protection against contact discharges at greater than 30kV. The diodes can also provide some EMI filtering, when used in combination with a PCB trace or series resistor. This device is particularly well suited for portable electronics (e.g. cellular telephones, PDAs, notebook computers) because of its small package format and easyto-use pin assignments. The CSPESD301/2/3 is available in a space-saving, low-profile, chip-scale package, and is fabricated with one of California Micro Devices' semiconductor processes.
Applications
* * * * * * I/O port protection for cellphones, notebook computers, PDAs etc. EMI filtering for data ports in cell phones, PDAs or notebook computers. Wireless Handsets MP3 Players Digital Still Cameras Handheld PCs / PDAs
Electrical Schematics
A2
B1
A1
B1
B2
A1
A2
B1
B2
CSPEMI301
CSPEMI302
CSPEMI303
(c) 2003 California Micro Devices Corp. All rights reserved. 02/12/03
430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214
L Fax: 408.263.7846
L
www.calmicro.com
1
PRELIMINARY
CSPESD301/302/303
PACKAGE / PINOUT DIAGRAMS
TOP VIEW (Bumps Down View)
Orientation Marking
BOTTOM VIEW (Bumps Up View)
1 A B
2
n*
B1 Orientation Marking
A1
B2 A2
A1
* See ordering information for appropriate part marking.
CSPESD301/302/303 4-Bump CSP Package
Notes: 1) These drawings are not to scale. 2) All 4 bumps are always present. Unused bumps are electrically unconnected.
Ordering Information
PART NUMBERING INFORMATION
Pins (Bumps) 4 4 4 Package CSP CSP CSP Ordering Part Number1 CSPESD301 CSPESD302 CSPESD303 Part Marking F G H
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
(c) 2003 California Micro Devices Corp. All rights reserved.
2
430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214
L Fax: 408.263.7846
L
www.calmicro.com
02/12/03
PRELIMINARY
CSPESD301/302/303
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER Storage Temperature Range DC Package Power Rating RATING -65 to +150 200 UNITS C mW
STANDARD OPERATING CONDITIONS
PARAMETER Operating Temperature Range RATING -40 to +85 UNITS C
ELECTRICAL OPERATING CHARACTERISTICS1
SYMBOL VDIODE ILEAK VSIG PARAMETER Diode Stand-off Voltage Diode Leakage Current Signal Voltage Positive Clamp Negative Clamp In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Diode Capacitance CONDITIONS IDIODE = +10A VIN=3.3V IDIODE = 10mA IDIODE = -10mA Notes 2, 3 and 4 +30 +15 Notes 2, 3 and 4 +19 -10 At 0VDC, 1MHz, 30mVAC 30 V V pF kV kV 6.0 -9.2 7.6 -7.6 MIN +5.9 100 9.2 -6.0 TYP MAX UNITS V nA V V
VESD
VCL
C DIODE
Note 1: Note 2: Note 3: Note 4:
TA=25C unless otherwise specified. ESD applied to input and output pins with respect to another diode, one at a time. Unused pins are left open These parameters are guaranteed by design and characterization.
(c) 2003 California Micro Devices Corp. All rights reserved. 02/12/03
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L Tel: 408.263.3214
L
Fax: 408.263.7846
L
www.calmicro.com
3
PRELIMINARY
CSPESD301/302/303
Performance Information
Simulated EMI Filter Performance (0 VDC, 50 Ohm Environment)
Figure 1. Typical EMI Filter Performance (Simulated) Diode Capacitance
Figure 2. Typical Diode Capacitance VS. Input Voltage (normalized to 0Vdc)
(c) 2003 California Micro Devices Corp. All rights reserved.
4
430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214
L Fax: 408.263.7846
L
www.calmicro.com
02/12/03
PRELIMINARY
CSPESD301/302/303
Application Information
Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices.
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Flux Ratio Solder Paste Type Pad Protective Finish Tolerance -- Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous (183C) Soldering Maximum Temperature VALUE 0.275mm Round Non-Solder Mask defined pads 0.325mm Round 0.150mm 0.330mm Round 50/50 by volume No Clean OSP (Entek Cu Plus 106A) +50m +20m 60 seconds 240C
Non-Solder Mask Defined Pad 0.275mm DIA.
Solder Stencil Opening 0.330mm DIA.
Solder Mask Opening 0.325mm DIA.
Figure 3. Recommended Non-Solder Mask Defined Pad Illustration
Figure 4. Solder Reflow Profile
(c) 2003 California Micro Devices Corp. All rights reserved. 02/12/03
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L Tel: 408.263.3214
L
Fax: 408.263.7846
L
www.calmicro.com
5
PRELIMINARY
CSPESD301/302/303
Mechanical Details
CSP Mechanical Specifications CSPESD301/302/303 devices are packaged in a custom Chip Scale Package (CSP). Dimensions are shown below. For complete information on CSP packaging, see the California Micro Devices CSP Package Information document. Mechanical Package Diagrams
BOTTOM VIEW
A1 C1 B1 B2
SIDE VIEW
PACKAGE DIMENSIONS
Package Bumps Dim A1 A2 B1 B2 C1 C2 D1 D2 Millimeters Min 0.881 1.015 0.495 0.495 0.163 0.230 0.561 0.355 Nom 0.925 1.060 0.500 0.500 0.213 0.280 0.605 0.380 Max 0.971 1.105 0.505 0.505 0.263 0.330 0.649 0.405 Min Custom CSP 4 Inches Nom Max 0.0347 0.0365 0.0382 0.0400 0.0417 0.0435 0.0195 0.0197 0.0199 0.0195 0.0197 0.0199 0.0064 0.0084 0.0104 0.0091 0.0110 0.0130 0.0221 0.0238 0.0255 0.0140 0.0150 0.0159 3500 pieces
B A2 A 1 2 C2 D1 D2
0.30 DIA. 63/37 Sn/Pb SOLDER BUMPS
DIMENSIONS IN MILLIMETERS
Package Dimensions for CSPESD301/302/303 Chip Scale Package
# per tape and reel
Controlling dimension: millimeters
CSP Tape and Reel Specifications
PART NUMBER CSPESD301 CSPESD302 CSPESD303 CHIP SIZE (mm) 1.33 X 0.96 X 0.6 POCKET SIZE (mm) B0 X A0 X K0 1.14 X 1.01 X 0.70 TAPE WIDTH W 8mm REEL DIAMETER 178mm (7") QTY PER REEL 3500 P0 4mm P1 4mm
Po Top Cover Tape
10 Pitches Cumulative Tolerance On Tape 0.2 mm
Ao W
Ko
Bo
For tape feeder reference only including draft. Concentric around B.
Embossment
P1 User Direction of Feed
Center Lines of Cavity
Figure 5. Tape and Reel Mechanical Data
(c) 2003 California Micro Devices Corp. All rights reserved.
6
430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214
L Fax: 408.263.7846
L
www.calmicro.com
02/12/03

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